The Trillion-Dollar Bottleneck of AI: Connectivity and Power — Fabric.AI

The Trillion-Dollar Bottleneck of AI:
Connectivity and Power

As copper interconnects reach their physical limits, connectivity — not compute — is emerging as AI's next critical bottleneck. Download the white paper to discover how Neural I/o™, a MicroLED-based optical interconnect platform, could help enable faster, more efficient AI infrastructure.

Why This White Paper Matters

AI workloads are doubling annually — but the infrastructure that carries the data between GPUs and processors hasn't kept pace. Traditional copper-based interconnects were designed for a different era. Today, they are the bottleneck that limits what AI can do at scale.

This white paper, developed jointly by Fabric.AI and Kopin Corporation, examines the underlying physics of the connectivity crisis, the economic and operational consequences for hyperscalers and data center operators, and how MicroLED-based optical interconnects represent a fundamental shift in how AI infrastructure can be built.

What You'll Learn

  • Why copper interconnects are hitting their physical limits at AI scale
  • The true cost of bandwidth constraints on AI training throughput
  • How MicroLED-based optical links eliminate resistive heat and power waste
  • The Neural I/o™ architecture — GPU-to-GPU at Tbps with sub-nanosecond latency
  • Why this is a $100B+ market opportunity developing in real time
  • The Fabric.AI and Kopin joint development roadmap

In Their Own Words

MicroLED-based interconnects are the leading edge in infrastructure for AI data centers. Kopin's expertise in MicroLED materials and fabrication, combined with our innovative system-level design for AI factories, creates a patent-protected technology position that we believe will define the next generation of data-center communication. This is a true technology partnership — Kopin brings the enabling hardware, and together we are building the infrastructure layer that AI factories will require to scale.
Josh Silverman
CEO, Fabric.AI (Nasdaq: FABC)
The marriage of our MicroLED technology with our bi-directional NeuralDisplay™ architecture is exactly what the industry needs to break through current interconnect bottlenecks. With Kopin and Fabric.AI's jointly developed Neural I/o™ technology, we're creating a faster, more efficient optical interface that is expected to be uniquely capable of supporting GPU-to-GPU communication at the massive scale this market requires — it's the right technology at the right moment to power the next wave of AI acceleration.
Michael Murray
CEO, Kopin Corporation (Nasdaq: KOPN)
A joint initiative by Fabric.AI
In collaboration with Kopin Corporation (KOPN)
Free White Paper

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